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VNQ600
Quad channel high side solid state relay
Features
Max supply voltage Max On-state resistance Current limitation (typ.)
1. Per each channel.
VCC RON ILIM
36V 35m(1) 25A

DC short circuit current: 25A CMOS compatible inputs Proportional load current sense. Undervoltage & overvoltage shutdown Overvoltage clamp Thermal shutdown Current limitation Very low standby power dissipation Protection against: - Loss of ground & loss of VCC Reverse battery protection
(a)
SO-28 (double island)
Description
The VNQ600 is a quad HSD formed by assembling two VND600 chips in the same SO-28 package. The VNQ600 is a monolithic device designed in| STMicroelectronics VIPower M0-3 Technology. The VNQ600 is intended for driving any type of multiple loads with one side connected to ground. This device has four independent channels and four analog sense outputs which deliver currents proportional to the outputs currents. Active current limitation combined with thermal shutdown and automatic restart protect the device against overload. Device automatically turns off in case of ground pin disconnection.
a. See Application schematic on page 17
Table 1.
Device summary Order codes Package Tube Tape and reel
VNQ60013TR
SO-28 (double island)
VNQ600
November 2008
Rev 10
1/26
www.st.com 26
Contents
VNQ600
Contents
1 2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 2.2 2.3 2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 17
3.1.1 3.1.2 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 17 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 18
3.2 3.3 3.4
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 19
4
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 SO-28 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 5.2 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SO-28 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26
VNQ600
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching (VCC=13V; Tj = 25C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Current sense (9V< VCC< 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Thermal calculation according to the PCB heatsink area . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-28 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3/26
List of figures
VNQ600
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 IOUT/ISENSE versus IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Off state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 ILIM vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 On state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SO-28 PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 21 Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Thermal fitting model of a quad channel HSD in SO-28 . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 SO-28 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SO-28 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 SO-28 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4/26
VNQ600
Block diagram and pin description
1
Block diagram and pin description
Figure 1. Block diagram
VCC 1,2
OVERVOLTAGE UNDERVOLTAGE DEMAG 1
DRIVER 1
OUTPUT 1 ILIM1
INPUT 1 LOGIC INPUT 2 GND 1,2 OVERTEMP. 1 OVERTEMP. 2 IOUT2
DRIVER 2
IOUT1
K
CURRENT SENSE 1 OUTPUT 2
DEMAG 2 ILIM2 K CURRENT SENSE 2
OVERVOLTAGE UNDERVOLTAGE DEMAG 3
DRIVER 3
VCC 3,4
OUTPUT 3 ILIM3
INPUT 3 LOGIC INPUT 4 GND 3,4 OVERTEMP. 3 OVERTEMP. 4 IOUT4
DRIVER 4
IOUT3
K
CURRENT SENSE 3 OUTPUT 4
DEMAG 4 ILIM4 K CURRENT SENSE 4
5/26
Block diagram and pin description Figure 2. Configuration diagram (top view)
VNQ600
VCC1,2 GND 1,2 INPUT2 INPUT1 CURRENT SENSE 1 CURRENT SENSE 2 VCC1,2 VCC3,4 GND 3,4 INPUT4 INPUT3 CURRENT SENSE 3 CURRENT SENSE 4 VCC3,4
1
28
VCC1,2 OUTPUT 2 OUTPUT 2 OUTPUT 2 OUTPUT 1 OUTPUT 1 OUTPUT 1 OUTPUT 4 OUTPUT 4 OUTPUT 4 OUTPUT 3 OUTPUT 3 OUTPUT 3
14
15
VCC3,4
Table 2.
Suggested connections for unused and not connected pins
Current sense N.C. X Through 1K resistor X Output X Input X Through 10K resistor
Connection / pin Floating To ground
6/26
VNQ600
Electrical specifications
2
2.1
Electrical specifications
Absolute maximum ratings
Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3.
Symbol VCC -VCC IOUT IR IIN
Absolute maximum rating
Parameter Supply voltage (continuous) Reverse supply voltage (continuous) Output current (continuous), for each channel Reverse output current (continuous), for each channel Input current Value 41 -0.3 15 -15 +/- 10 -3 +15 -200 Unit V V A A mA V V mA
VCSENSE Current sense maximum voltage IGND Ground current at Tpins < 25 C (continuous) Electrostatic discharge (Human Body Model: R=1.5K; C=100pF) - INPUT - CURRENT SENSE - OUTPUT - VCC Maximum switching energy (L=0.11mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=40A) Power dissipation (per island) at Tlead=25C Junction operating temperature Storage temperature
VESD
4000 2000 5000 5000 126 6.25 Internally limited -55 to 150
V V V V mJ W C C
EMAX Ptot Tj Tstg
7/26
Electrical specifications
VNQ600
2.2
Thermal data
Table 4.
Symbol Rthj-lead Rthj-amb Rthj-amb
Thermal data (per island)
Parameter Thermal resistance junction-lead Thermal resistance junction-ambient (one chip ON) Thermal Resistance junction-ambient (two chips ON) 60(1) 46(1) Value 20 45(2) 31(2) Unit C/W C/W C/W
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow. 2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 m thick) connected to all VCC pins. Horizontal mounting and no artificial air flow.
2.3
Electrical characteristics
Values specified in this section are for 8VIS3,4 VCC3,4 IIN1 VIN1 VSENSE1 VIN2 VSENSE2 VIN3 ISENSE1 IIN2 ISENSE2 IIN3 ISENSE3 INPUT1 CUR. SENSE1 INPUT2 CUR. SENSE2 INPUT3 CUR. SENSE3 INPUT4 CUR. SENSE4 GND3,4 IGND3,4 OUTPUT3 IOUT4 OUTPUT4 GND1,2 IGND1,2 VOUT4 VOUT3 OUTPUT2 IOUT3 VOUT2 OUTPUT1 IOUT2 IOUT1 VOUT1 VCC3,4 VCC1,2 VF1 IS1,2 VCC1,2
VSENSE3 IIN4 VIN4 ISENSE4 VSTAT4
Note:
VFn = VCCn - VOUTn during reverse battery condition.
8/26
VNQ600 Table 5.
Symbol VCC VUSD VOV RON Vclamp
Electrical specifications Power
Parameter Operating supply voltage Undervoltage shutdown Overvoltage shutdown On state resistance Clamp voltage IOUT1,2,3,4=5A; Tj=25C IOUT1,2,3,4=5A; Tj=150C IOUT1,2,3,4=3A; VCC=6V ICC=20mA Off State; VCC=13V; VIN=VOUT=0V Off State; VCC=13V; VIN=VOUT=0V; Tj =25C On State; VCC=13V; VIN=5V; IOUT=0A; RSENSE=3.9K VIN=VOUT=0V VIN=0V; VOUT=3.5V VIN=VOUT=0V; VCC=13V; Tj =125C VIN=VOUT=0V; VCC=13V; Tj =25C 0 -75 41 48 12 Test conditions Min. 5.5 3 36 35 70 120 55 40 Typ. 13 4 Max. 36 5.5 Unit V V V m m m V A
IS
Supply current
12
25 6 50 0 5 3
A mA A A A A
IL(off1) IL(off2) IL(off3) IL(off4)
Off state output current Off state output current Off state output current Off state output current
Note:
Vclamp and VOV are correlated. Typical difference is 5V. Table 6.
Symbol Ilim TTSD TR Thyst Vdemag VON
Protections
Parameter DC Short circuit current Thermal shutdown temperature Thermal reset temperature Thermal hysteresis Turn-off output voltage clamp IOUT=2A; L=6mH Test conditions VCC=13V 5.5V150 135 7 VCC-41
175
Output voltage drop IOUT=0.5A; Tj= -40C...+150C limitation
Note:
To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.
9/26
Electrical specifications Table 7.
Symbol td(on) td(off) (dVOUT/dt)on (dVOUT/dt)off
.
VNQ600
Switching (VCC=13V; Tj = 25C)
Parameter Turn-on delay time Turn-off delay time Turn-on voltage slope Turn-off voltage slope Test conditions RL=2.6 channels 1,2,3,4 (see Figure 5) RL=2.6 channels 1,2,3,4 (see Figure 5) RL=2.6 channels 1,2,3,4 (see Figure 5) RL=2.6 channels 1,2,3,4 (see Figure 5) Min. Typ. 40 40 See Figure 10 See Figure 12 Max. Unit s s V/ s V/ s
Table 8.
Symbol K1
Current sense (9V< VCC< 16V)
Parameter IOUT/ISENSE Test conditions IOUT1 or IOUT2=0.5A; VSENSE=0.5V; other channels open; Tj= -40C...150C IOUT1 or IOUT2=0.35A; VSENSE=0.5V; other channels open; Tj= -40C...150C IOUT1 or IOUT2=5A; VSENSE=4V; other channels open; Tj=-40C Tj=25C...150C IOUT1 or IOUT2=2A; VSENSE=2.5V; other channels open; Tj=-40C...150C IOUT1 or IOUT2=15A; VSENSE=4V; other channels open; Tj=-40C Tj=25C...150C IOUT1 or IOUT2=15A; VSENSE=4V; other channels open; Tj=-40C...150C VCC=5.5V; IOUT1,2=2.5A; RSENSE=10k VCC>8V, IOUT1,2=5A; RSENSE=10k Min. 3300 Typ. 4400 Max. 6000 Unit
dK1/K1
Current sense ratio drift
-10
+10
%
K2
IOUT/ISENSE
4200 4400
4900 4900
6000 5750
dK2/K2
Current sense ratio drift
-6
+6
%
K3
IOUT/ISENSE
4200 4400 -6
4900 4900
5500 5250 +6 %
dK3/K3
Current sense ratio drift
VSENSE1,2
Max analog sense output voltage Analog sense output voltage in overtemperature condition
2 4
V V
VSENSEH
VCC= 13V; RSENSE= 3.9k
5.5
V
10/26
VNQ600 Table 8.
Symbol
Electrical specifications Current sense (9V< VCC< 16V) (continued)
Parameter Test conditions VCC=13V; Tj>TTSD; All channels open To 90% ISENSE(1) Min. Typ. Max. Unit
Analog sense output Impedance in RVSENSEH overtemperature condition tDSENSE Current sense delay response
400
500
s
1. Current sense signal delay after positive input slope.
Table 9.
Symbol VIL VIH VI(hyst) IIL IIN VICL
Logic inputs
Parameter Low level input voltage High level input voltage Input hysteresis voltage Input current Input current Input clamp voltage VIN=1.5V VIN=3.5V IIN=1mA IIN= -1mA 6 6.8 -0.7 3.25 0.5 1 10 8 Test conditions Min. Typ. Max. 1.25 Unit V V V A A V V
Table 10.
Symbol VF
VCC - output diode
Parameter Forward on voltage Test conditions -IOUT=2.30A; Tj=150C Min. Typ. Max. 0.6 Unit V
Figure 4.
IOUT/ISENSE
IOUT/ISENSE versus IOUT
6500 6000 5500 5000 4500 4000 3500 3000
min.Tj=25...150C typical value max.Tj=25...150C max.Tj=-40C
min.Tj=-40C
0
2
4
6
IOUT (A)
8
10
12
14
16
11/26
Electrical specifications Figure 5. Switching characteristics
VOUT
VNQ600
80% dVOUT/dt(on) tr ISENSE 90% 10%
90% dVOUT/dt(off) tf t
INPUT
tDSENSE
t td(off)
td(on)
t
Table 11.
Truth table
Input L H L H L H L H L H H L H L Output L H L L L L L L L L L H H L Sense 0 Nominal 0 VSENSEH 0 0 0 0 0 (TjTTSD) VSENSEH 0 < Nominal 0
Conditions Normal operation Overtemperature Undervoltage Overvoltage
Short circuit to GND
Short circuit to VCC Negative output voltage clamp
12/26
VNQ600 Table 12.
ISO T/R 7637/1 Test pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test pulse 1 2 3a 3b 4 5 Class C E
Electrical specifications Electrical transient requirements
Test levels I -25V +25V -25V +25V -4V +26.5V Test levels II -50V +50V -50V +50V -5V +46.5V Test levels III -75V +75V -100V +75V -6V +66.5V Test levels IV -100V +100V -150V +100V -7V +86.5V Test levels delays and impedance 2ms, 10 0.2ms, 10 0.1s, 50 0.1s, 50 100ms, 0.01 400ms, 2
Test levels result I C C C C C C
Test levels result II C C C C C E
Test levels result III C C C C C E
Test levels result IV C C C C C E
Contents All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device.
13/26
Electrical specifications Figure 6. Waveforms
NORMAL OPERATION INPUTn LOAD CURRENTn SENSEn UNDERVOLTAGE VCC INPUTn LOAD CURRENTn SENSEn OVERVOLTAGE
VOV VUSD VUSDhyst
VNQ600
VCC INPUTn LOAD CURRENTn SENSEn
VCC < VOV
VCC > VOV
SHORT TO GROUND INPUTn LOAD CURRENTn LOAD VOLTAGEn SENSEn
SHORT TO VCC INPUTn LOAD VOLTAGEn LOAD CURRENTn SENSEn
OVERTEMPERATURE Tj INPUTn LOAD CURRENTn SENSEn
ISENSE= VSENSEH RSENSE TTSD TR
14/26
VNQ600
Electrical specifications
2.4
Figure 7.
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50
Electrical characteristics curves
Off state output current Figure 8.
Iih (uA)
5
High level input current
IL(off1) (uA)
Off state Vcc= 36V Vin= Vout= 0V
4.5 4 3.5 3 2.5 2 1.5 1 0.5 0
Vin= 3.25V
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
100
125
150
175
Tc (C)
Tc (C )
Figure 9.
Vicl (V)
8 7.8 7.6 7.4 7.2 7 6.8 6.6 6.4 6.2 6 -50
Input clamp voltage
Figure 10. Turn-on voltage slope
I 1mA in=
-25
0
25
50
75
100
125
150
175
Tc (C )
Figure 11. Overvoltage shutdown
Vov (V)
50 48 46 44 42 40 38 36 34 32 30 -50 -25 0 25 50 75 100 125 150 175
Figure 12. Turn-off voltage slope
Tc (C )
15/26
Electrical specifications
VNQ600
Figure 13. ILIM vs Tcase
Ilim (A)
20 18 16 14 12 10 8 6 4 2 0 -50 -25 0 25 50 75 100 125 150 175
Figure 14. On state resistance vs VCC
R on (mOhm)
80
Vcc= 13V
70
I out= 5A
60 50 40 30 20
Tc= 150C
Tc= 25C
Tc= - 40C
10 0 5 10 15 20 25 30 35 40
Tc (C )
Vcc (V)
Figure 15. Input high level
Vih (V)
3.6 3.4 3.2 3 2.8 2.6 2.4
Figure 16. Input hysteresis voltage
Vhyst (V)
1.5 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7
2.2 2 -50 -25 0 25 50 75 100 125 150 175
0.6 0.5 -50 -25 0 25 50 75 100 125 150 175
Tc (C )
Tc (C )
Figure 17. On state resistance vs Tcase
Ron (mOhm)
100 90 80 70 60 50 40 30 20 10 0 -75 -50 -25 0 25 50 75 100 125 150 175
Figure 18. Input low level
Vil (V)
2.6
I out= 5A Vcc= & 36V 8V
2.4 2.2 2 1.8 1.6 1.4 1.2 1 -50 -25 0 25 50 75 100 125 150 175
Tc (C)
Tc (C )
16/26
VNQ600
Application information
3
Application information
Figure 19. Application schematic
+5V Rprot INPUT1 VCC1,2 VCC3,4 Dld Rprot Rprot C. SENSE 1 INPUT2 OUTPUT1
C Rprot Rprot INPUT3 Rprot Rprot Rprot C. SENSE 4 GND1,2 GND3,4 C. SENSE 3 INPUT4 OUTPUT4 OUTPUT3 C. SENSE 2 OUTPUT2
RSENSE1,2,3,4 VGND
RGND DGND
Note:
Channels 3 & 4 have the same internal circuit as channel 1 & 2.
3.1
GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against reverse battery.
3.1.1
Solution 1: a resistor in the ground line (RGND only)
This can be used with any type of load. The following show how to dimension the RGND resistor: 1. 2. RGND 600mV / 2(IS(on)max) RGND (- CC) / (-IGND) V
where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power dissipation in RGND (when VCC<0 during reverse battery situations) is: PD= (-VCC)2/RGND
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Application information
VNQ600
This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that, if the microprocessor ground is not shared by the device ground, then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same RGND. If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below.
3.1.2
Solution 2: a diode (DGND) in the ground line
A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. Series resistor in INPUT and STATUS lines are also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating. Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2
Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC maximum DC rating. The same applies if the device is subject to transients on the VCC line that are greater than those shown in the ISO T/R 7637/1 table.
3.3
MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/O pins from latching up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os: -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax
Example
For the following conditions: VCCpeak= - 100V Ilatchup 20mA VOHC 4.5V 5k Rprot 65k . Recommended values are: Rprot =10k
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VNQ600
Application information
3.4
Maximum demagnetization energy (VCC = 13.5V)
Figure 20. Maximum turn-off current versus load inductance
LMAX (A) I
100
A B C
10
1 0.001
0.01
0.1
L (mH)
1
10
100
A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C
VIN, IL Demagnetization Demagnetization Demagnetization
t
Note:
Values are generated with RL=0. In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C.
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Package and PCB thermal data
VNQ600
4
4.1
Package and PCB thermal data
SO-28 thermal data
Figure 21. SO-28 PC board
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: 0.5 cm2, 3 cm2, 6 cm2).
Table 13.
Chip 1 ON OFF ON ON
Thermal calculation according to the PCB heatsink area
Chip 2 OFF ON ON ON Tjchip1 RthA x Pdchip1 + Tamb RthC x Pdchip2 + Tamb RthB x (Pdchip1 + Pdchip2) + Tamb (RthA x Pdchip1) + RthC x Pdchip2 + Tamb Tjchip2 RthC x Pdchip1 + Tamb RthA x Pdchip2 + Tamb RthB x (Pdchip1 + Pdchip2) + Tamb (RthA x Pdchip2) + RthC x Pdchip1 + Tamb Pdchip1=Pdchip2 Pdchip1Pdchip2 Note
RthA = Thermal resistance Junction to Ambient with one chip ON RthB = Thermal resistance Junction to Ambient with both chips ON and Pdchip1=Pdchip2 RthC = Mutual thermal resistance
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VNQ600
Package and PCB thermal data Figure 22. Rthj-amb Vs PCB copper area in open box free air condition
RTHj_amb (C/ W) 70 60 50 40 30 20 10 0 1 2 3 4 5 PCB Cu heats ink area (cm^ is land 2)/ 6 7
Figure 23. Thermal impedance junction ambient single pulse
Zth(C/ W)
100
0,5 cm ^ is land 2/ 3 cm ^ is land 2/ 6 cm ^ is land 2/
10
One channel ON
1
Two channels ON on same chip
0.1
0.01 0.0001
0.001
0.01
0.1 1 time(s)
10
100
1000
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Package and PCB thermal data Equation 1: pulse calculation formula
Z TH = R TH + Z THtp ( 1 - )
where
VNQ600
= tp T
Figure 24. Thermal fitting model of a quad channel HSD in SO-28
Tj_1
C1 C2 C3 C4 C5 C6
P d1
R1
R2
R3
R4
R5
R6
T j _2
P d2
C 13
C 14
R 13
R 14
R 17
R 18
Tj_3
P d3
C7
C8
C9
C 10
C 11
C 12
R7
R8
R9
R 10
R 11
R 12
T j _4
P d4
C 15
C 16
R 15
R 16
T_amb
Table 14.
Thermal parameters
Area/island (cm2) R1=R7=R13=R15 (C/W) R2=R8=R14=R16 (C/W) R3=R9 (C/W) R4=R10 (C/W) R5=R11 (C/W) R6=R12 (C/W) C1=C7=C13=C15 (W.s/C) C2=C8=C14=C16 (W.s/C) C3=C9 (W.s/C) C4=C10 (W.s/C) C5=C11 (W.s/C) C6=C12 (W.s/C) R17=R18 (C/W) 0.5 0.05 0.3 3.4 11 15 30 0.001 5.00E-03 1.00E-02 0.2 1.5 5 150 8 13 6
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VNQ600
Package and packing information
5
5.1
Package and packing information
ECOPACK(R) packages
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 25. SO-28 package dimensions
Table 15.
SO-28 mechanical data
Millimeters
Symbol Min. A a1 b b1 C c1 D E e e3 F L S 7.40 0.40 8 (max.) 17.7 10.00 1.27 16.51 7.60 1.27 0.10 0.35 0.23 0.50 45 (typ.) 18.1 10.65 Typ. Max. 2.65 0.30 0.49 0.32
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Package and packing information
VNQ600
5.2
SO-28 packing information
Figure 26. SO-28 tube shipment (no suffix)
Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1)
All dimensions are in mm.
C B
28 700 532 3.5 13.8 0.6
A
Figure 27. SO-28 tape and reel shipment (suffix "TR")
Reel dimensions
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 1000 1000 330 1.5 13 20.2 16.4 60 22.4
Tape dimensions
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 16 4 12 1.5 1.5 7.5 6.5 2
End
All dimensions are in mm.
Start Top cover tape No components 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min Components No components
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VNQ600
Revision history
6
Revision history
Table 16.
Date Nov-2004 02-Jul-2004 22-Jul-2004 14-Aug-2004 04-Apr-2005 17-Apr-2005 29-May-2006 19-Nov-2006 18-Jul-2007 11-Nov-2008
Document revision history
Revision 1 2 3 4 5 6 7 8 9 10 Initial release. Added Table 16: Document revision history. Updated disclaimer. Updated Figure 3: Current and voltage conventions. Added Figure 2.: Configuration diagram (top view). Added Table 2: Suggested connections for unused and not connected pins. Updated Table 14: Thermal parameters: added 6 cm2 Cu condition. Updated Table 10: VCC - output diode. Updated Table 6: Protections: added note. Document converted to corporate template. Changes
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VNQ600
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